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A&J Vacuum Services, Inc. offers a wide range of Refurbished Turbomolecular Pumps. All Pumps are fully rebuilt,
tested and come with Standard 12-Months warranty. Below are the most popular Turbo Pumps. If you do not see the model
that you are looking for please contact us, we have many more that are not listed. |
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Pumping speed 41 cfm, Ultimate pressure <3-10-2, Inlet flange ISO 63, The L70 is a low cost dry pump specifically designed for clean load-locks and similar applications. |
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Pumping speed 24 cfm , Ultimate pressure < 5 -10-3. Pumps are recomended for process like load lock, PVD and similar applications. |
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Lower Utilities Costs
Typically a 40% saving can be made on utilities costs over an entire fab.
* Based on a 300mm fab in the US, containing 200 tools, 537 pumps
* 70% iGX pumps, 30% iH pumps
* iGX fitted with constant flow water valve
Designed for Energy Efficiency
* High performance motors and inverter drives
o Low operating power consumption
o Lower power standby mode using Active Utility Control (AUC)
* Nitrogen dilution can be tuned to the application requirement
o Minimizes gas usage
* Highly efficient cooling
o High conductivity materials and good design enables low water flow
* Precision ceramic bearings
o Very high load capability for reliability
o Low noise and vibration
Ethernet Connectivity
The iGX Series includes unique web serving functionality that allows viewing of key parameters through a simple Ethernet connection and browser. Any user can simply connect to the pump to view a range of information, such as:
* Operating status
* Key parameters
* Parameter setpoints
* Alert summary |
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Pumping speed 24 cfm -56 cfm, Ultimate pressure <1 - 10 - 2 mbar
Inlet connection IS0 40 bolted for IQDP 40 and ISO 63 bolted for
IQDP 80. Pumps are recommended for process like load lock, PVD, and
Similar applications. |
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Pumping speed 59 cfm, Ultimate pressure < 5 - 10 - 3 mbar.
Inlet connection NW 40, Outlet connection NW25 .
IPX 100 is an innovative concept in next generation pumping.
Integrated onto process tool platforms it has established a proven
Track record for extremely high performance and reliability. |
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The iL is specifically designed for clean processes to give very low cost of ownership and exceptional reliability, requiring zero periodic maintenance between rebuilds. With their quite operation, small footprint and high pump speeds, they are ideally suited to loadlock, transfer chamber, PVD, SEM and similar duties.
Features and Benefits:
* Low cost of ownership with no nitrogen (iL), low power and low consumption of cooling water
* Compact, efficient design with small footprint and high pumping speed
* High reliability, resulting in low service costs
* Comply with CE, SEMI S2 & UL |
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T100L is an ultra compact new generation dry vacuum pump jointly developed by Toyota Industries Corp. and Applied Materials, Inc., which is designed for installation on semiconductor equipment in cleanroom
Features
* Size(L*W*H) :590*280*300mm
* Ultimate Pressure Pa(Torr) :1.1 (0.008)
* Peak Pumping Speed m3/h :100
* Power Consumption kW :1.5
* Sound Level dB(A): 55
* Vibration G:0.1
* Weight kg:104 |
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T1000L is an ultra compact new generation dry vacuum pump jointly developed by Toyota Industries Corp. and Applied Materials, Inc., which is designed for installation on semiconductor equipment in cleanroom
Features
* Size(L*W*H) :590*280*300mm
* Ultimate Pressure Pa(Torr) :1.1 (0.008)
* Peak Pumping Speed m3/h :100
* Power Consumption kW :1.5
* Sound Level dB(A): 55
* Vibration G:0.1
* Weight kg:104 |
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High reliability to process
• Wide interstage channels are able to accommodate large quantities of powder and particles.
• High operating temperature with a precise closed-loop temperature management system, and a linear increase of gas temperature from inlet to outlet.
• Vertical pumping on each stage which prevents particulate accumulation in the swept volume.
Semiconductor fab rules compliant
• Compact: the series 2 model is only 390 mm wide.
• Clean: Alcatel technology is a frictionless and oil-free pump mechanism. There is no risk of particulate contamination.
• Quiet: All models include an integrated silencer, eliminating the need for an additional external silencer.
• Semi S2 compliant.
Low cost of ownership
• Low power consumption at working pressures and at Ultimate Pressure.
• With moderate heat generation, series 2 water consumption is extremely low.
• Nitrogen Purge level is easily set by the customer. Pumps for clean applications do not require any purge.
Typical applications:
• ADP 122 LM, ADS 602 LM:
Load Lock, Transfer Chambers, PVD, Sputtering
• ADP 122 P, ADS 602 P, ADS 1202 P, ADS 1802 P:
Ashing, Stripping, Dielectric - Poly Etch, Implant Source, Medium CVD
• ADS 602 H, ADS 1202 H, ADS 1802 H:
PECVD, LPCVD |
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High reliability to process
• Wide interstage channels are able to accommodate large quantities of powder and particles.
• High operating temperature with a precise closed-loop temperature management system, and a linear increase of gas temperature from inlet to outlet.
• Vertical pumping on each stage which prevents particulate accumulation in the swept volume.
Semiconductor fab rules compliant
• Compact: the series 2 model is only 390 mm wide.
• Clean: Alcatel technology is a frictionless and oil-free pump mechanism. There is no risk of particulate contamination.
• Quiet: All models include an integrated silencer, eliminating the need for an additional external silencer.
• Semi S2 compliant.
Low cost of ownership
• Low power consumption at working pressures and at Ultimate Pressure.
• With moderate heat generation, series 2 water consumption is extremely low.
• Nitrogen Purge level is easily set by the customer. Pumps for clean applications do not require any purge.
Typical applications:
• ADP 122 LM, ADS 602 LM:
Load Lock, Transfer Chambers, PVD, Sputtering
• ADP 122 P, ADS 602 P, ADS 1202 P, ADS 1802 P:
Ashing, Stripping, Dielectric - Poly Etch, Implant Source, Medium CVD
• ADS 602 H, ADS 1202 H, ADS 1802 H:
PECVD, LPCVD |
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The DRYSTAR GV80 dry pump is available as a stand alone unit or in combination with an EH500A hydrokinetic drive mechanical booster for applications where more pumping speed and/or lower vacuum levels are required - no pressure switches required.
The scope of supply includes as standard a in-line pressure regulator, gauge for facilitating the shaft seal purge, and a cleanable and drainable stainless steel exhaust silencer. An atmospheric seal purge kit is available for applications and pumping parameters that meet the criteria are variable |
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Pumping speed 47 cfm , Ultimate pressure < 4.00-10-2, Inlet flange DN40. Pump recommended for process like Load Lock, Transfer Chamber, PVD, Sputtering. |
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High reliability to process
• Wide interstage channels are able to accommodate large quantities of powder and particles.
• High operating temperature with a precise closed-loop temperature management system, and a linear increase of gas temperature from inlet to outlet.
• Vertical pumping on each stage which prevents particulate accumulation in the swept volume.
Semiconductor fab rules compliant
• Compact: the series 2 model is only 390 mm wide.
• Clean: Alcatel technology is a frictionless and oil-free pump mechanism. There is no risk of particulate contamination.
• Quiet: All models include an integrated silencer, eliminating the need for an additional external silencer.
• Semi S2 compliant.
Low cost of ownership
• Low power consumption at working pressures and at Ultimate Pressure.
• With moderate heat generation, series 2 water consumption is extremely low.
• Nitrogen Purge level is easily set by the customer. Pumps for clean applications do not require any purge.
Typical applications:
• ADP 122 LM, ADS 602 LM:
Load Lock, Transfer Chambers, PVD, Sputtering
• ADP 122 P, ADS 602 P, ADS 1202 P, ADS 1802 P:
Ashing, Stripping, Dielectric - Poly Etch, Implant Source, Medium CVD
• ADS 602 H, ADS 1202 H, ADS 1802 H:
PECVD, LPCVD |
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High reliability to process
• Wide interstage channels are able to accommodate large quantities of powder and particles.
• High operating temperature with a precise closed-loop temperature management system, and a linear increase of gas temperature from inlet to outlet.
• Vertical pumping on each stage which prevents particulate accumulation in the swept volume.
Semiconductor fab rules compliant
• Compact: the series 2 model is only 390 mm wide.
• Clean: Alcatel technology is a frictionless and oil-free pump mechanism. There is no risk of particulate contamination.
• Quiet: All models include an integrated silencer, eliminating the need for an additional external silencer.
• Semi S2 compliant.
Low cost of ownership
• Low power consumption at working pressures and at Ultimate Pressure.
• With moderate heat generation, series 2 water consumption is extremely low.
• Nitrogen Purge level is easily set by the customer. Pumps for clean applications do not require any purge.
Typical applications:
• ADP 122 LM, ADS 602 LM:
Load Lock, Transfer Chambers, PVD, Sputtering
• ADP 122 P, ADS 602 P, ADS 1202 P, ADS 1802 P:
Ashing, Stripping, Dielectric - Poly Etch, Implant Source, Medium CVD
• ADS 602 H, ADS 1202 H, ADS 1802 H:
PECVD, LPCVD |
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High reliability to process
• Wide interstage channels are able to accommodate large quantities of powder and particles.
• High operating temperature with a precise closed-loop temperature management system, and a linear increase of gas temperature from inlet to outlet.
• Vertical pumping on each stage which prevents particulate accumulation in the swept volume.
Semiconductor fab rules compliant
• Compact: the series 2 model is only 390 mm wide.
• Clean: Alcatel technology is a frictionless and oil-free pump mechanism. There is no risk of particulate contamination.
• Quiet: All models include an integrated silencer, eliminating the need for an additional external silencer.
• Semi S2 compliant.
Low cost of ownership
• Low power consumption at working pressures and at Ultimate Pressure.
• With moderate heat generation, series 2 water consumption is extremely low.
• Nitrogen Purge level is easily set by the customer. Pumps for clean applications do not require any purge.
Typical applications:
• ADP 122 LM, ADS 602 LM:
Load Lock, Transfer Chambers, PVD, Sputtering
• ADP 122 P, ADS 602 P, ADS 1202 P, ADS 1802 P:
Ashing, Stripping, Dielectric - Poly Etch, Implant Source, Medium CVD
• ADS 602 H, ADS 1202 H, ADS 1802 H:
PECVD, LPCVD |
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The DRYVAC 25P, 50P and 100 P are dry-compression vacuum pumps designed especially for semiconductor etching and CVD processes. |
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The DRYVAC 25P, 50P and 100 P are dry-compression vacuum pumps designed especially for semiconductor etching and CVD processes. |
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The iH system operates at pressures between atmospheric and ultimate vacuum with no lubricating or sealing fluid in the pumping chamber. This ensures a clean pumping system without back-migration of oil into the system being evacuated.
The iH80 system has an HCDP80 dry pump; The HCDP pump has enclosed, water-cooled motors. The iH system is therefore suitable for applications in clean environments where fan cooling of motors is unacceptable.
The iH system has a gas system which introduces purge gas into the HCDP pump. This gas system is suitable for use on harsh duty processes. If you use the iH system on light or medium duty processes, you can use the economiser gas mode to reduce the consumption of purge nitrogen by the pumping system.
You can manually control the iH system through the Pump Display Terminal. Alternatively, you can use your process tool or other control equipment to control the operation of the iH system through an Interface Module or through an iM Communications Module accessory or you can use the iH Single Equipment Monitor accessory to control the operation of the iH system.
Applications
* Load Lock
* Transfer
* Metrology
* Lithography
* PVD Process
* PVD Pre-clean
* RTA
* Strip/Ashing
* Etching
* Implant Source
* HDP CVD
* RTP
* SACVD
* MCVD
* PECVD
* LPCVD
* ALD |
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QDP-80 Dry Vacuum Pump is a four-stage, positive displacement rotary pump. These "Dry Pumps" are ideal for the corrosive enviroment of semiconductor processing. The applications range from light duty loadlock and sputtering to demanding processes including plasma etch, LPCVD, PECVD, and MOCVD. |
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The iH system operates at pressures between atmospheric and ultimate vacuum with no lubricating or sealing fluid in the pumping chamber. This ensures a clean pumping system without back-migration of oil into the system being evacuated.
The iH600 system has an HCDP80 dry pump, with an HCMB600 mechanical booster pump fitted to the inlet of the HCDP80 pump. Both the HCDP and HCMB pumps have enclosed, water-cooled motors. The iH system is therefore suitable for applications in clean environments where fan cooling of motors is unacceptable.
The iH system has a gas system which introduces purge gas into the HCDP pump. This gas system is suitable for use on harsh duty processes. If you use the iH system on light or medium duty processes, you can use the economiser gas mode to reduce the consumption of purge nitrogen by the pumping system.
You can manually control the iH system through the Pump Display Terminal. Alternatively, you can use your process tool or other control equipment to control the operation of the iH system through an Interface Module or through an iM Communications Module accessory or you can use the iH Single Equipment Monitor accessory to control the operation of the iH system.
Applications
* Load Lock
* Transfer
* Metrology
* Lithography
* PVD Process
* PVD Pre-clean
* RTA
* Strip/Ashing
* Etching
* Implant Source
* HDP CVD
* RTP
* SACVD
* MCVD
* PECVD
* LPCVD
* ALD |
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